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PCB manufacturing
1. The highest 64-layer PCB processing technology, the minimum line width spacing is 2.5/2.5mil, and the highest board thickness aperture ratio is 16:1;
2. Long and short golden finger processing technology and high-density circuit precision control to meet the design requirements of circuit boards in the field of optoelectronic communication;
3. High-precision back-drilling technology reduces the equivalent series inductance of the via and meets the integrity requirements of product signal transmission;
4. Excellent metal base and ultra-thick copper manufacturing process to meet the high heat dissipation requirements of power products:
5. High-precision machinery and laser depth control technology realize the product structure of multi-step grooves, which meets the assembly requirements of different levels of products;
6. The mature mixing technology realizes the mixing of FR-4 and high-frequency materials, saving material costs for customers on the premise of meeting the high-frequency performance of the product;
7. Advanced Anti-CAF process technology greatly improves the reliability and service life of PCB products;
8. Leading buried capacitor and buried resistor technology, the board greatly improves the performance of PCB products;
Strict PCB board quality management
1. UL certification;
2. ISO9001: 2008 quality system certification;
3. ISO/TS1694: 2009 system certification;
4. GJB9001B military standard system certification;
5. Enterprise standards such as Huawei/ZTE;
6. Strictly manage the processing of customized products in accordance with IPC6012II/1l/military standard/customer standard/internal standards of the enterprise;
7. Strict customer information confidentiality management system.
| Technical route | |||||
| Item Item | 2016 | 2017 | 2018 | ||
| Number of Layers level | Conventional board | 2-36 | 2-40 | 2-40 | |
| Buried IC implantation IC | no | yes | yes | ||
| HDI high-density interconnect | 1-2 Order | 1-4 Order | 1-5 Order | ||
| Materials Materials | FR4 (Shengyi) | yes | yes | yes | |
| High Tg High Tg | Tg-170 | Tg-210 | Tg-220 | ||
| EHalongen Free halogen-free | yes | yes | yes | ||
| High Frequency HF | yes | yes | yes | ||
| Maximum board size Maximum overall dimensions | 20*30inch | 20*30inch | 20*35inch | ||
| Board thickness thickness | 0.21-6.0mm | 0.21-6.0mm | 0.21-6.0mm | ||
| Minimum line width minimum line width | 3mil-inner 3mil-outer | 2mil-inner 3mil-outer | 2mil-inner 2mil-outer | ||
| Minimum Line gap Min.Trace.Spacing | 3mil-inner 3mil-outer | 2mil-inner 3mil-outer | 2mil-inner 2mil-outer | ||
| Outer layer copper thickness layer thickness maximum copper | 5OZ | 7oz | 7oz | ||
| Inner layer copper thickness inner maximum copper thickness | 5OZ | 7oz | 7oz | ||
| Min. finished hole size (Mechanical ) | 0.15mm | yes | yes | yes | |
| Min. finished hole size (laser hole ) | 0.076mm | yes | yes | yes | |
| Aspect ratio Maximum thickness aperture ratio | 16 : 1 | 20 : 1 | 20 : 1 | ||
| Solder Mask Types and brand Solder Mask Types and brand | NAYA (LP-4G) | yes | yes | yes | |
| Tamura (TT19G) | yes | yes | yes | ||
| TAIYO (PSR2200) | yes | yes | yes | ||
| Solder Mask Color solder resist ink color | green; blue; red; white; black green, blue, red, white, black | yes | yes | yes | |
| Impedance Control Tolerance Impedance Control Tolerance | 5% | yes | yes | yes | |
| Plug via hole via plug hole | M in. size can be plugged: | 0.1mm | 0.1mm | 0.1mm | |
| Max. size can be plugged: | 0.70mm | 0.70mm | 0.70mm | ||
| Min . annular ring can be kept | 3mil | 3mil | 3mil | ||
| Min . Distance BETWEEN The IC PADS CAN Keep SM Bridge smallest IC tube pitch (solder bridge can be retained) | 8mil | 8mil | 8mil | ||
| Min. SM bridge for green soldermask minimum solder bridge (green oil) | 3mil | 3mil | 3mil | ||
| Min. SM bridge for black soldermask minimum solder bridges (black oil) | 4mil | 4mil | 4mil | ||
| Surface Treatment Surface Treatment Type | H ASL spray tin | yes | yes | yes | |
| ENIG Immersion Gold | yes | yes | yes | ||
| OSP | yes | yes | yes | ||
| LEAD FREE HASL lead-free spray tin | yes | yes | yes | ||
| GOLD PLATING gold plated | yes | yes | yes | ||
| IMMERSION Ag Immersion Silver | yes | yes | yes | ||
| IMMERSION Sn Immersion Tin | yes | yes | yes | ||
| V-Cut | CNC V-cut, degree | 20\30\45\60 | 20\30\45\60 | 20\30\45\60 | |
| V-cut by hand, degree | 20\30\45\60 | 20\30\45\60 | 20\30\45\60 | ||
| Outline Profile Shape | CNC | CNC | CNC | ||
| Chamfer fillet | T he angle type of the chamfer: | 20\30\45 | 20\30\45 | 20\30\45 | |
| Min. distance of jumping chamfer: | 5mm | 5mm | 5mm | ||
| Tolerance of the dimension size Dimension Tolerance | ±0.1mm | ±0.1mm | ±0.1mm | ||
| Tolerance of the board thickness Thickness Tolerance | 0.21---1.0 | ±0.1 | ±0.1 | ±0.1 | |
| 1.0--2.5 | ±7% | ±7% | ±7% | ||
| 2.5-6.3 | ±6% | ±6% | ±6% | ||
| Tolerance of the finished hole size finished hole tolerance | 0-0.3 | +0.08mm | +0.08mm | +0.08mm | |
| 0.31---0.8mm | ±0.08mm | ±0.08mm | ±0.08mm | ||
| 0.81-1.60mm | ±0.05mm | ±0.05mm | ±0.05mm | ||
| 1.61-2.49mm | ±0.75mm | ±0.75mm | ±0.75mm | ||
| 2.5-6.0mm | +0.15/-0mm | +0.15/-0mm | +0.15/-1mm | ||
| >6.0mm | +0.3 /-0mm | +0.3 /-0mm | +0.3 /-1mm | ||
| Certificates (copies are needed) certificate | U L | E360485 | E360485 | E360485 | |
| ISO9001 | yes | yes | yes | ||
| ISO14000 | yes | yes | yes | ||
| ROHS | yes | yes | yes | ||
| TS16949 | yes | yes | yes | ||
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