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Multilayer module circuit board with half hole
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  • Multilayer module circuit board with half hole

Multilayer module circuit board with half hole

The company's products are widely used in communications, industrial control, computer applications, aerospace, military, medical, testing instruments and other fields. Core competitiveness: leading process and technology, high quality, high punctuality, expedited delivery, consulting customer service, optimal cost performance. With ISO9001, ISO14001, TS16949, ISO13485, GJB9001A, UL (e360485), ROHS certification.
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High frequency communication PCB

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  • Product description
    • Commodity name: Multilayer module circuit board with half hole
    • Commodity ID: 1302930648523755520

    Production capacity reference:

    1) Layer: 1-30

    2) Thickness of finished circuit board: 0.21mm-7.0mm

    3)Material: FR-4, CEM-1, CEM-3, High Tg, FR4 Halogen Free, Rogers

    4) Maximum finished board size: 23×25 (580mm×900mm)

    5) Minimum drilling size: 0.2mm

    6) Minimum line width: 3mil (0.075mm)

    Min.Line pitch: 3mil (0.075mm)

    7) Surface treatment/treatment: spray tin/lead-free spray tin lead-free, spray tin, chemical tin, chemical gold, immersion silver/gold, OSP, gold plating

    8) Copper Thickness: 0.5-7.0 oz

    9) Solder mask color: green/yellow/black/white/red/blue

    10) Copper Thickness, Hole: >25.0 microns (>1 mil)

    11) Inner packing: vacuum packing/polybag

    Outer packing: standard carton packing

    12) Outline tolerance: ±0.13

    Hole tolerance: PTH: ±0.076 NPTH: ±0.05

    13) Certification: UL, ISO 9001, ISO14001

    14) Special requirements: buried blind via + controlled impedance + BGA

    15) Anatomy: Punching, Routing, V-CUT, Chamfering

    16) Provided a variety of printed circuit board assembly foundry services, as well as electronic packaging products

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