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Process Description
Board name: Multi-layer high TG half-hole board
Sheet: FR4 Shengyi High TG170
Board thickness: 1.6mm
Number of layers: 10 layers
Single board size: 55X55mm
Surface treatment process: Immersion gold
Copper thickness: 1OZ
Line width/line distance: 3.5/4mil
Aperture: 0.2mm
Impedance: 5 groups
Features: Multi-layer half-hole module board process
Terminal Products: Satellite Communication Terminal