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- Product description
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Product Category: Communication blind buried via board
Number of floors: 4 floors
Board thickness: 1.0mm
Copper thickness: 1OZ inside and outside
Size: 138.16mm*89.91mm
Board used: FR4
Minimum aperture: 0.25mm
Surface treatment: Immersion gold
Solder mask: green oil
Application field: high-end communication
Features: blind and buried hole design